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Metal Layers in the chip

Posted: Tue Apr 07, 2015 5:33 pm
by vikramrajput
Hello,

Can any one tell me about the different metal layers used in the chip layout. I know that the metal layers are used for routing.But I have a confusion, all the core cells are placed on core area while metal layers are used for routing. Is it true , core area is used only for placement of cells and macros while metal layers are used only for routing ?? And there are some metal layers which are used only for some specific purpose like power and ground routing .And other layers are used for some other purpose ?
Please help me out in this.

Re: Metal Layers in the chip

Posted: Sat Apr 11, 2015 10:30 am
by Narveer
Correct! Top layer are used for power & ground as they are thicker & hence less resistive. Lower layers are used for signal routing. But there is no hard & fast rule for this.

Re: Metal Layers in the chip

Posted: Thu Dec 31, 2015 2:14 pm
by nsuresh60
How to decide a chip will require certain number of metal layers? how to decide it? what are the considerations?

Re: Metal Layers in the chip

Posted: Fri Aug 24, 2018 12:05 pm
by nithin
but while manufacturing is it lower metal layers will get manufacture first?