Metal Layers in the chip
Posted: Tue Apr 07, 2015 5:33 pm
Hello,
Can any one tell me about the different metal layers used in the chip layout. I know that the metal layers are used for routing.But I have a confusion, all the core cells are placed on core area while metal layers are used for routing. Is it true , core area is used only for placement of cells and macros while metal layers are used only for routing ?? And there are some metal layers which are used only for some specific purpose like power and ground routing .And other layers are used for some other purpose ?
Please help me out in this.
Can any one tell me about the different metal layers used in the chip layout. I know that the metal layers are used for routing.But I have a confusion, all the core cells are placed on core area while metal layers are used for routing. Is it true , core area is used only for placement of cells and macros while metal layers are used only for routing ?? And there are some metal layers which are used only for some specific purpose like power and ground routing .And other layers are used for some other purpose ?
Please help me out in this.